Ghost of Yōtei centers on Atsu, a survivor of a violent attack by a group known as the Yōtei Six. Sixteen years after being left for dead, Atsu returns to her homeland of Ezo (present-day Hokkaido) to track down and eliminate each member of the group. The recently released trailer highlights the intensity of her journey, showing glimpses of the antagonists and the aftermath of their brutal actions.

The game will give players freedom to tackle the story at their own pace. Each of the Yōtei Six can be hunted in any order, offering a non-linear narrative structure. Exploration is another key feature, allowing players to roam the landscape of Ezo, establish temporary camps, and uncover hidden stories across the region. Despite its revenge-driven plot, the game promises emotional depth through Atsu’s evolving relationships with the characters she meets along the way.

Sony also revealed three editions of Ghost of Yōtei:

• Standard Edition – Priced at $69.99, it includes the full game and pre-order bonuses such as a set of seven PSN avatars and an exclusive in-game mask cosmetic.
• Digital Deluxe Edition – At $79.99, this version includes the base game, four additional cosmetic items, and early access to the in-game Traveler’s Map.
• Collector’s Edition – Retailing for $249.99, this bundle includes all Digital Deluxe content plus a range of physical collectibles. These include a replica of Atsu’s mask, a traditional sash, a tsuba (sword guard), art cards, a zeni hajiki coin game with pouch, and a papercraft model of the ginkgo tree where Atsu’s story begins.

Pre-orders for all editions will open on May 2 at 10:00 AM local time.

While the game is launching as a PlayStation 5 exclusive, Sucker Punch has not provided any timeline for when or if the title will expand to other platforms. Industry speculation suggests a potential PC release may not occur until at least 2027.

Sony has also hinted at plans for a broader Ghost of Tsushima universe, with spin-offs for television and film under consideration. For now, Ghost of Yōtei is shaping up to be one of the more prominent PlayStation 5 exclusives for the year, blending open-world exploration with a focused revenge narrative set in a historical Japanese backdrop.

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The Glacier One D30 X2 is part of the company’s expanding NEXLINQ product line and introduces the latest D30 series fans. These fans are designed to interconnect, forming a single, rigid frame. This approach reduces cable clutter, as both lighting and fan speed can be controlled through a single connection. It also improves the overall appearance of the build by minimizing visible wiring.

Thermal performance is handled by a large copper base and a dense fin array, which together help dissipate heat efficiently, even under heavy workloads. The cooler is compatible with Intel’s LGA 1700, 1200, and 115x sockets, as well as AMD’s AM4 and AM5 platforms, making it suitable for most modern processors.

Phanteks has also focused on physical compatibility. The Glacier One D30 X2 is built with clearance in mind, allowing it to fit into a wide range of cases without interfering with tall memory modules or large VRM heatsinks. The pump cover is made from brushed aluminum and features a compact design inspired by the company’s Evolv X2 series. An integrated fan within the pump housing helps direct airflow over nearby motherboard components, including VRMs and M.2 drives, contributing to better system stability.

The cooler’s appearance is clean and modern, and it is available in both black and white to match different system themes. The D-RGB lighting on the fans and pump cover adds subtle customization without being overbearing.

Phanteks is positioning the Glacier One D30 X2 as a reliable cooling solution that combines practical design with solid performance. Its updated fan system, broad compatibility, and streamlined layout are intended to simplify the building process and improve everyday use.

The 360mm version of the Phanteks Glacier One D30 X2 is now available in black and white color options, each priced at $179.99 / €179.90 / £159.90. The larger 420mm version will be available in May, priced at $189.99 / €189.90 / £169.90. More information can be found on the official Phanteks website.

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The remaster was developed in collaboration with Virtuos, a studio known for its experience in remastering classic titles. Built on Unreal Engine 5, Oblivion Remastered introduces a wide range of improvements aimed at modernizing the game for new hardware, while staying faithful to the original design. Players returning to Cyrodiil will find an overhauled environment featuring updated textures, lighting, and water effects. The remaster also includes reworked animations for characters, weapons, and spells, as well as a dynamic time of day and weather system.

In addition to visual enhancements, the game incorporates several updates to gameplay and user interface. The HUD, menus, and map have been redesigned for better clarity and ease of use. Systems such as Persuasion and Clairvoyance now feature improved interfaces. Changes to levelling, encumbrance, and enemy scaling aim to make progression smoother and more accessible, especially for new players. The update also introduces expanded accessibility features and a revised camera system for both first- and third-person perspectives.

Elder Scrolls IV: Oblivion Remastered includes the base game and both major expansion packs: Knights of the Nine and Shivering Isles. Bethesda has also released a Deluxe Edition, which can be purchased separately or as an upgrade. This version includes exclusive content such as additional quests, unique gear sets, a digital artbook, and the official soundtrack.

For long-time fans, the remaster offers a new way to revisit familiar locations and quests with modern enhancements. For newcomers, it serves as an entry point into one of the most influential open-world RPGs in gaming history.

The Elder Scrolls IV: Oblivion Remastered is now available worldwide, marking a return to the province of Cyrodiil with improved visuals and updated mechanics, while preserving the core identity that made the original a classic.

Source: Xbox News

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The FA‑EX9 measures 192 × 190 × 55 mm and fits within a 2-liter chassis. It includes a 16-core processor based on AMD’s Zen 5 architecture and a built-in graphics solution with 40 compute units from the RDNA 3.5 generation. A separate processing unit is also included for handling specialized tasks, rated for up to 50 trillion operations per second. FEVM has tuned the processor to run at up to 120 watts of continuous power, placing it in the same performance category as some high-end laptop setups that combine top-tier CPUs with dedicated graphics cards.

For memory, the FA‑EX9 includes 128 GB of LPDDR5X running across a 256-bit interface. Of that total, up to 96 GB can be used by the built-in graphics, providing headroom for handling complex workloads. Storage options consist of two M.2 PCIe 4.0 slots, supporting up to 2 TB on a single drive and up to 16 TB total capacity when fully populated.

In terms of external connectivity, the system includes one HDMI 2.1 output, one DisplayPort 1.4, and two USB4 Type-C ports, allowing for support of up to four displays at 8K resolution. There is also an OCuLink interface, which provides the option to connect a desktop graphics card externally.

The FA‑EX9 appears to be designed with flexibility in mind, capable of supporting a range of use cases, including content creation, development workloads, and entertainment. Its design and feature set suggest that FEVM is positioning it as a compact workstation that can fit into small spaces without sacrificing capability.

This new system enters the market at a time when other manufacturers are also introducing high-performance mini PCs. For example, NVIDIA’s recently announced DGX Spark features its Grace Blackwell superchip and is built for performance in a small chassis. The Spark combines a 20-core processor with a new graphics engine and is optimized for complex computing tasks. It includes 128 GB of memory, up to 4 TB of storage, and network connectivity that supports 200 Gbps.

While both systems are compact, the FA‑EX9 provides more expandability and balanced general-purpose computing, whereas the DGX Spark is more focused on performance tuning and specific high-demand applications.

FEVM has not yet shared a release date or price for the FA‑EX9, but the hardware specifications suggest it is aimed at professionals who need strong computing power in a compact desktop. More information is expected to follow soon.

Sources: FEVN

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The Gaming Pixel Light comes with a matrix-style LED panel and is available in two size options: 32×32 and 52×32. One of its main highlights is support for animation playback at up to 30 frames per second. Users can create and upload their own GIFs, providing a more personalized and dynamic visual display compared to traditional ambient lights.

According to Govee, the Pixel Light uses “advanced LED technology” to deliver consistent brightness and sharp image quality across the entire panel. This is expected to result in clearer visuals, whether users are displaying artwork, icons, or short looping animations.

The product is compatible with the Govee Home mobile app, which acts as the main control center for customizing the light display. Through the app, users can upload images and convert them into pixel-style graphics. In addition, the app includes a built-in library of 150 themed pixel-style images. The app also features a built-in image generator tool, which allows users to create new designs directly within the app environment.

Beyond visual customization, the Gaming Pixel Light includes several practical display features. These include a countdown timer, weather forecast integration, and support for showing real-time NBA schedules. These added functions are aimed at making the device more useful as a desktop companion outside of gaming sessions.

The Govee Gaming Pixel Light is currently in pre-sale and is scheduled for official release on May 19. Pricing has been set at $119.99 USD / €99.99 for the 32×32 version and $139.99 USD / €119.99 for the 52×32 version.

Govee continues to expand its portfolio of smart lighting solutions, and the Govee Gaming Pixel Light adds a new interactive element to its lineup, blending creative expression with functional desktop utilities. With its combination of lighting features and animated content support, the device is positioned as both a decorative and informative addition to gaming and workspaces.

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As applications continue to demand more memory, especially in tasks involving large datasets, complex video processing, or machine learning models, the need for both speed and capacity in system memory becomes more critical. The new G.SKILL kit aims to meet that demand by combining ultra-high density with competitive overclocked performance.

Tested with AMD EXPO memory profiles, the kit has been validated on platforms including the ASUS ROG CROSSHAIR X870E HERO paired with the AMD Ryzen 7 9800X3D, as well as the MSI MPG X870E CARBON WIFI with the Ryzen 9 9900X. These platforms have successfully demonstrated stable operation at DDR5-6000 CL32 using the full 256 GB capacity.

G.SKILL also demonstrated the overclocking potential of this memory configuration by pushing it to DDR5-7000 with timings of CL38-50-50. This was achieved on the MSI MEG X870E GODLIKE motherboard alongside the Ryzen 7 9800X3D processor. Running at this level is notable, as maintaining high frequencies while using high-capacity modules across all four slots can often present stability challenges.

In addition to performance at higher frequencies, G.SKILL showcased the 256 GB kit operating at DDR5-6400 with CL32 timings across a mix of hardware configurations. These include the ASUS ROG CROSSHAIR X870E HERO with the Ryzen 9 9900X3D, and the MSI MAG B850M MORTAR WIFI motherboard paired with the Ryzen 7 9800X3D. Achieving low-latency performance at 6400 MT/s across four 64 GB modules reflects both strong binning of memory ICs and careful tuning of platform compatibility.

This memory kit adds to G.SKILL’s growing lineup of DDR5 products and represents a step forward in capacity and performance for users building systems for intensive multitasking, data-heavy workflows, or future-ready computing tasks. As high-capacity DDR5 becomes more available and supported across platforms, these kits provide another option for users looking to push the limits of their desktop or workstation builds.

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The Hong Kong Electronics Fair is one of Asia’s largest electronics trade shows and regularly attracts key players across the global tech industry. LincPlus will use this platform to demonstrate new offerings aimed at users looking for compact, powerful, and easy-to-manage solutions for data storage and creative workflows.

LincStation NAS Series to Take Center Stage

LincPlus will debut the LincStation NAS series at the exhibition, which includes two models: the LincStation S1 and the LincStation N2.

The LincStation S1 is built for small businesses and creative professionals who need scalable, secure storage. It runs on an Intel Alder Lake-N N97 quad-core processor and includes 8 GB of DDR5 RAM, which can be upgraded. It supports up to four 3.5-inch SATA hard drives and two M.2 NVMe SSDs, offering a combined storage capacity of up to 112 TB. Dual 2.5GbE Ethernet ports support fast file transfers, and the system runs UnRAID OS, a flexible platform for storage management and virtualization. The hybrid SSD/HDD setup gives users flexibility between speed and capacity.

Meanwhile, the LincStation N2 caters to users seeking a compact, all-SSD storage solution. It features an Intel Alder Lake-N N100 processor and 16 GB of LPDDR5 memory. The unit houses four M.2 NVMe SSD slots and two 2.5-inch SATA bays, with network connectivity through a 10GbE RJ45 port. The N2 is designed for tasks that demand high throughput, such as media streaming, project collaboration, and remote access. It also uses UnRAID OS, giving users tools for file sharing, backup, and containerized applications.

Both NAS units focus on ease of use and centralized data access without subscription-based cloud storage fees, making them practical options for users who prefer on-premises solutions.

LincStudio S1: A Portable Creative Workstation

In addition to its NAS lineup, LincPlus will introduce the LincStudio S1, a 13-inch all-in-one tablet designed for content creators. It comes equipped with an Intel 11th Gen Core i7-1165G7 processor and Intel Iris Xe Graphics. With 16 GB of LPDDR4X RAM and a 512 GB SSD, the device is built to handle demanding creative tasks.

The display is a 13-inch In-cell IPS panel with a 2160×1440 resolution and 100% sRGB color coverage. It includes a Wacom EMR stylus with 4096 pressure levels and tilt recognition, making it suitable for drawing, photo editing, and graphic design. Running on Windows 11, the LincStudio S1 supports standard desktop applications and creative software suites.

Weighing just 1.1 kg, the tablet includes a detachable keyboard and an integrated stand, making it easy to carry and use on the go. It also features two Thunderbolt 4 USB-C ports, one USB-A 3.0 port, a headphone jack, and front and rear cameras (8MP and 13MP). A 39.33Wh battery supports extended use away from a power source.

Focus on Practical Design and User Needs

LincPlus continues to position itself as a brand focused on practical innovation. Its in-house R&D and supply chain allow for tight integration between design and manufacturing. At this year’s show, the company is emphasizing usability, performance, and form factor across its product range.

Visitors to the Hong Kong Electronics Fair can explore the new LincPlus products in person, view live demos, and discuss use cases with the company’s technical representatives. With the introduction of the LincStation series and the LincStudio S1 tablet, LincPlus aims to address key needs in storage and mobility for small businesses and creative professionals.

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At the center of the LANCOOL 207 Digital’s new features is a 6-inch touchscreen embedded into the lower front panel of the case. The display has a resolution of 720×1600, a 60 Hz refresh rate, and brightness rated at 500 nits. It is connected via USB and controlled through LIAN LI’s L-Connect 3 software. This screen allows users to monitor real-time data such as CPU and GPU temperatures, fan speeds, and system load. It also supports background customization using personal videos or images. In addition to acting as a monitoring tool, the screen functions as a secondary display and can show system information even when the main PC is powered off, thanks to its Offline Mode.

Internally, the LANCOOL 207 Digital retains the unique design elements introduced in the original LANCOOL 207. This includes a front-mounted power supply unit (PSU) and a recessed motherboard tray. These design choices help optimize internal space and allow for better airflow while keeping the overall dimensions compact. This layout is especially helpful for users installing larger graphics cards, as it clears up space around the PCIe area and simplifies cable routing.

To ensure effective cooling, the case comes equipped with two 140 mm PWM fans at the front and two 120 mm PWM fans mounted on the bottom. This setup is designed to provide immediate airflow toward the graphics card and maintain system-wide ventilation. The top of the case supports radiators up to 360 mm, offering compatibility for custom or all-in-one liquid cooling solutions. Dust filters are also integrated at key intake and exhaust points to help keep the interior clean over time.

The LANCOOL 207 Digital continues LIAN LI’s approach of providing functional PC cases with builder-friendly features. It offers toolless panels, removable drive cages, and well-thought-out cable management paths. Despite the inclusion of a secondary display and additional fan support, the case remains affordable, targeting users who want a feature-rich chassis without crossing into premium pricing territory.

The LANCOOL 207 Digital will be available starting April 18, 2025, in black. Further details, including specifications and accessory support, can be found on LIAN LI’s official product page.

Specifications

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The TeamGroup X2 MAX Portable SSD supports the USB 3.2 Gen 2×1 interface, offering read and write speeds of up to 1,000 MB/s. This makes it suitable for tasks involving large file transfers, such as 4K video editing or moving high-resolution image libraries. The drive comes with dual connectors—USB Type-A and Type-C—allowing it to be used with a wide range of devices, including Windows PCs, Macs, Android phones, and gaming consoles like PlayStation and Xbox.

With a weight of just 12 grams and a maximum capacity of 2 TB, the X2 MAX is designed for portability without compromising on storage space. It eliminates the need for extra adapters or cables, as the built-in connectors provide direct access for most modern devices. Whether used for storing AAA game titles or backing up important work files, the X2 MAX provides a flexible option for users needing fast and reliable storage on the go.

Also announced is the TeamGroup S5 USB Flash Drive, which features a USB 3.2 Gen 1 interface and supports read speeds of up to 140 MB/s. Built using Chip On Board (COB) technology, the S5 is more resistant to physical damage, moisture, and dust. This enhances its durability and helps maintain data integrity even under frequent use.

The S5 is available in capacities from 32 GB to 512 GB and weighs only 2 grams. Its lightweight body includes a large built-in keyhole, making it easy to attach to keychains or bags. The drive’s design supports both everyday use and secure data storage for travel or work environments.

TeamGroup offers a five-year warranty on the X2 MAX Portable SSD and a lifetime warranty for the S5 Flash Drive, underlining its commitment to quality and long-term support. Both products are expected to be available through TeamGroup’s global distribution network in the coming weeks.

With the launch of these two devices, TeamGroup continues to expand its portfolio with storage solutions that combine performance, portability, and broad compatibility for users across different platforms.

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The case features three-sided tempered glass panels on the left, front, and right, allowing visibility into the system from multiple angles. The internal frame uses a brushed aluminum alloy structure that helps with the installation of cooling fans at the top and bottom. This design keeps the fan layout clean and aligned with the case’s appearance. A concave rear panel helps increase internal space, and an ARGB light strip designed in a “cutting line” pattern adds lighting without overwhelming the look.

In terms of compatibility, the Evolv S2 supports E-ATX motherboards up to 280mm wide, along with standard ATX boards. The case allows for CPU coolers up to 175mm tall, graphics cards up to 395mm in length (when using a graphics card bracket), and power supplies up to 210mm long. For storage, it includes a hard drive bracket at the bottom front of the case. This bracket provides one slot for a 3.5-inch hard drive and a second slot that can hold either another 3.5-inch drive or two 2.5-inch drives.

Phanteks ships the Evolv S2 with four M25-120 fans. One fan uses a standard blade design while the other three use reverse blades. The cooling layout is based on a vertical airflow path, pulling air in from the bottom and exhausting it through the top and rear. Users also have the option to install up to three extra 120mm fans or a 360mm radiator at the top for additional cooling.

The front panel of the Evolv S2 is split into two areas. The power and reset buttons are located on the upper right section of the front panel. The I/O ports are placed on the lower left side of the left front foot, and include one USB-C port (20 Gbps), two USB-A ports (5 Gbps), and a combined audio jack for headset use.

At the moment, the Evolv S2 has only been announced for the Chinese market. There is no information yet regarding availability in other regions.

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