DDR5 Archives - XiaomiToday https://xiaomitoday.com/tag/ddr5/ Tech & Gadget Mon, 21 Apr 2025 14:19:38 +0000 en-US hourly 1 https://wordpress.org/?v=6.8 https://xiaomitoday.com/wp-content/uploads/2024/11/WhatsApp-Image-2024-11-12-at-9.00.34-PM-e1731423693360-150x150.jpeg DDR5 Archives - XiaomiToday https://xiaomitoday.com/tag/ddr5/ 32 32 G.SKILL Announces 256 GB DDR5-6000 Memory Kit with 64 GB Modules for High-End Workloads https://xiaomitoday.com/g-skill-announces-256-gb-ddr5-6000-memory-kit-with-64-gb-modules-for-high-end-workloads/ https://xiaomitoday.com/g-skill-announces-256-gb-ddr5-6000-memory-kit-with-64-gb-modules-for-high-end-workloads/#respond Mon, 21 Apr 2025 14:19:37 +0000 https://xiaomitoday.com/?p=18315 G.SKILL has introduced a new high-capacity DDR5 memory kit designed for advanced computing workloads. The latest release features a total capacity of 256 GB, configured as four 64 GB modules, and is capable of running at DDR5-6000 with CL32 timings. This kit is based on high-performance SK hynix DDR5 ICs and targets professional users in […]

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G.SKILL has introduced a new high-capacity DDR5 memory kit designed for advanced computing workloads. The latest release features a total capacity of 256 GB, configured as four 64 GB modules, and is capable of running at DDR5-6000 with CL32 timings. This kit is based on high-performance SK hynix DDR5 ICs and targets professional users in areas such as content creation, AI processing, and high-performance desktop systems.

As applications continue to demand more memory, especially in tasks involving large datasets, complex video processing, or machine learning models, the need for both speed and capacity in system memory becomes more critical. The new G.SKILL kit aims to meet that demand by combining ultra-high density with competitive overclocked performance.


Tested with AMD EXPO memory profiles, the kit has been validated on platforms including the ASUS ROG CROSSHAIR X870E HERO paired with the AMD Ryzen 7 9800X3D, as well as the MSI MPG X870E CARBON WIFI with the Ryzen 9 9900X. These platforms have successfully demonstrated stable operation at DDR5-6000 CL32 using the full 256 GB capacity.

G.SKILL also demonstrated the overclocking potential of this memory configuration by pushing it to DDR5-7000 with timings of CL38-50-50. This was achieved on the MSI MEG X870E GODLIKE motherboard alongside the Ryzen 7 9800X3D processor. Running at this level is notable, as maintaining high frequencies while using high-capacity modules across all four slots can often present stability challenges.


In addition to performance at higher frequencies, G.SKILL showcased the 256 GB kit operating at DDR5-6400 with CL32 timings across a mix of hardware configurations. These include the ASUS ROG CROSSHAIR X870E HERO with the Ryzen 9 9900X3D, and the MSI MAG B850M MORTAR WIFI motherboard paired with the Ryzen 7 9800X3D. Achieving low-latency performance at 6400 MT/s across four 64 GB modules reflects both strong binning of memory ICs and careful tuning of platform compatibility.

This memory kit adds to G.SKILL’s growing lineup of DDR5 products and represents a step forward in capacity and performance for users building systems for intensive multitasking, data-heavy workflows, or future-ready computing tasks. As high-capacity DDR5 becomes more available and supported across platforms, these kits provide another option for users looking to push the limits of their desktop or workstation builds.

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G.SKILL Introduces Industry-First 128GB DDR5-8000 Memory Kit and New DDR5-9000 Specification https://xiaomitoday.com/g-skill-introduces-industry-first-128gb-ddr5-8000-memory-kit-and-new-ddr5-9000-specification/ https://xiaomitoday.com/g-skill-introduces-industry-first-128gb-ddr5-8000-memory-kit-and-new-ddr5-9000-specification/#respond Fri, 04 Apr 2025 13:04:17 +0000 https://xiaomitoday.com/?p=17844 G.SKILL today announced the release of two new high-performance DDR5 memory kits, including the world’s first 128GB (2x64GB) DDR5-8000 kit and a 64GB (2x32GB) DDR5-9000 kit. These new kits target enthusiasts and power users who require high-capacity and high-speed memory for next-generation desktop platforms from both AMD and Intel. The 128GB DDR5-8000 kit is notable […]

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G.SKILL today announced the release of two new high-performance DDR5 memory kits, including the world’s first 128GB (2x64GB) DDR5-8000 kit and a 64GB (2x32GB) DDR5-9000 kit. These new kits target enthusiasts and power users who require high-capacity and high-speed memory for next-generation desktop platforms from both AMD and Intel.

The 128GB DDR5-8000 kit is notable for being the first to use dual 64GB modules operating at this frequency. The memory kit is rated at DDR5-8000 with latency timings of CL44-58-58. According to G.SKILL, this configuration has been validated on the AMD X870 chipset using the ASUS ROG Crosshair X870E APEX motherboard and paired with the upcoming AMD Ryzen 9 9950X3D processor. The kit supports AMD EXPO memory overclocking profiles, enabling easier setup and tuning for compatible AMD systems.

G.SKILL has provided burn-in validation results showing the 128GB kit operating under extended stress testing, which demonstrates stability at the rated speeds. This level of performance is typically used in content creation, heavy multitasking, and workstation-level workloads where large memory capacity and bandwidth can improve overall system responsiveness.

Alongside the 128GB kit, G.SKILL also introduced a new 64GB DDR5-9000 memory kit made up of two 32GB modules. This kit is rated at DDR5-9000 with latency timings of CL48-64-64. Each 32GB module is constructed from high-quality ICs and is designed to push performance boundaries on Intel platforms.


The DDR5-9000 kit has been tested on Intel’s upcoming Z890 chipset, using the ASUS ROG Maximus Z890 APEX motherboard in combination with the Core Ultra 7 265K processor. It also supports Intel XMP 3.0 profiles, allowing for automatic configuration of the memory settings in the BIOS for optimized performance.

Both memory kits are part of G.SKILL’s continued effort to deliver cutting-edge memory solutions for users looking to take advantage of the latest desktop platforms. The introduction of a 64GB module at DDR5-8000 represents a significant development in memory density and speed, as most high-frequency kits until now have been limited to lower capacities.

G.SKILL has not yet disclosed pricing or release dates for these kits, but they are expected to become available alongside the launch of AMD’s X870 and Intel’s Z890 platforms. As DDR5 adoption continues to grow, these new offerings provide additional options for users looking to maximize both speed and capacity in high-end systems.

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Biwin Partners with OC Lab to Unveil High-Performance OC Lab Gold Edition DW100 RGB DDR5 Memory Modules https://xiaomitoday.com/biwin-partners-with-oc-lab-to-unveil-high-performance-oc-lab-gold-edition-dw100-rgb-ddr5-memory-modules/ https://xiaomitoday.com/biwin-partners-with-oc-lab-to-unveil-high-performance-oc-lab-gold-edition-dw100-rgb-ddr5-memory-modules/#respond Thu, 27 Feb 2025 12:32:50 +0000 https://xiaomitoday.com/?p=16688 Biwin has announced the launch of the OC Lab Gold Edition DW100 RGB DDR5 memory modules in collaboration with OC Lab. These new modules include DDR5-8000 CL34 & CL36 (32GB kits with 2x16GB modules) and an alternative DDR5-6400 CL28 EXPO profile, providing high-speed performance for extreme gaming and professional workloads. Pushing Overclocking Boundaries: DDR5-8000 CL34 […]

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Biwin has announced the launch of the OC Lab Gold Edition DW100 RGB DDR5 memory modules in collaboration with OC Lab. These new modules include DDR5-8000 CL34 & CL36 (32GB kits with 2x16GB modules) and an alternative DDR5-6400 CL28 EXPO profile, providing high-speed performance for extreme gaming and professional workloads.

The Biwin OC Lab Gold Edition DW100 DDR5-8000 memory kits are engineered for enthusiasts and professionals seeking extreme overclocking potential. Utilizing advanced binning techniques and high-quality IC selection, these modules push the limits of DDR5 memory performance while maintaining stability.


Key highlights of the DDR5-8000 memory modules:

  • Ultra-high frequency of 8000 MT/s, with manual overclocking capabilities reaching up to 8400 MT/s.
  • Low-latency configurations of CL34 and CL36, offering superior responsiveness in gaming and benchmarking applications.
  • Compatibility with leading motherboard brands, including ASUS, MSI, Gigabyte, and ASRock.
  • Stability tested with Ryzen 9 9000 Series processors and X870/B850/B840 chipsets under Memtest stress conditions.

These memory modules cater to competitive gamers, overclockers, and content creators who demand top-tier performance without compromise.

In addition to its high-frequency DDR5-8000 offering, Biwin introduces an optimized DDR5-6400 EXPO profile with CL28 latency. This configuration strikes a balance between high frequency and low latency, ensuring seamless system responsiveness.

Advantages of DDR5-6400 CL28:

  • Faster load times and smoother gameplay experience.
  • Improved efficiency for content creation, data-intensive applications, and productivity tasks.
  • BIOS tuning support for further refinement, including potential optimizations reaching 8000 MT/s at CL30 and 6400 MT/s at CL26.


The OC Lab Gold Edition DW100 RGB DDR5 modules incorporate cutting-edge design elements to ensure long-term stability and cooling efficiency:

  • 10-layer PCB Design – Reduces electromagnetic interference for cleaner data signals.
  • Unlocked PMIC (Power Management Integrated Circuit) – Provides dynamic voltage regulation for enhanced power stability.
  • Three-Fin Heat Spreader – Ensures effective heat dissipation, keeping temperatures below 50°C during prolonged high-load testing at 1.45V and 1.50V.

These design elements allow the memory to maintain consistent performance under heavy workloads, making it a reliable choice for power users.

Beyond performance, the Biwin OC Lab Gold Edition DW100 series stands out with its striking gold-accented design, complementing high-end gaming rigs and professional workstations. The modules feature:

  • A sleek black and gold aesthetic for a premium look.
  • Eight-zone RGB lighting with full customization options.
  • Compatibility with major RGB lighting control software, allowing seamless synchronization with other system components.

The Biwin OC Lab Gold Edition DW100 RGB DDR5 memory modules will be available for purchase in late March 2025. Pricing starts at $169 on Amazon, with additional availability at select retailers.

With cutting-edge speeds, low latency, and premium design, the Biwin OC Lab Gold Edition DW100 series is an ideal upgrade for gaming enthusiasts, professional content creators, and overclockers looking to maximize their system’s potential.

Source

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G.SKILL Introduces Enhanced DDR5 R-DIMM Memory with Advanced Signal Integrity and Voltage Protection https://xiaomitoday.com/g-skill-introduces-enhanced-ddr5-r-dimm-memory-with-advanced-signal-integrity-and-voltage-protection/ https://xiaomitoday.com/g-skill-introduces-enhanced-ddr5-r-dimm-memory-with-advanced-signal-integrity-and-voltage-protection/#respond Fri, 21 Feb 2025 13:25:05 +0000 https://xiaomitoday.com/?p=16331 G.SKILL has unveiled an enhanced revision of its DDR5 R-DIMM memory modules. This latest iteration aligns with the newly released JEDEC revision standards for DDR5 R-DIMM and introduces significant design upgrades, including a 16-layer PCB for improved signal integrity and the integration of transient voltage suppression (TVS) diodes along with a fuse for enhanced voltage […]

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G.SKILL has unveiled an enhanced revision of its DDR5 R-DIMM memory modules. This latest iteration aligns with the newly released JEDEC revision standards for DDR5 R-DIMM and introduces significant design upgrades, including a 16-layer PCB for improved signal integrity and the integration of transient voltage suppression (TVS) diodes along with a fuse for enhanced voltage protection. Targeted at enterprise servers and professional workstations, the new DDR5 R-DIMM memory kits are designed to deliver superior stability and reliability for high-performance computing environments.

One of the standout features of the new DDR5 R-DIMM memory is the adoption of a 16-layer printed circuit board (PCB), marking a significant leap over traditional 8- or 10-layer designs. This enhancement improves signal integrity by reducing electrical interference and crosstalk, ensuring stable data transmission even in intensive computing scenarios. Whether deployed in enterprise servers running complex simulations or high-performance workstations handling large-scale data processing, the improved PCB structure facilitates consistent and efficient memory performance.

Power fluctuations can pose a significant threat to memory stability and longevity. To counteract this, G.SKILL has equipped its new DDR5 R-DIMM modules with two bi-directional TVS diodes and a fuse. This dual-layer protection mechanism helps maintain consistent voltage levels while shielding against sudden power surges, thereby minimizing the risk of component failure. By implementing these safeguards, G.SKILL ensures that its DDR5 R-DIMM memory remains a dependable solution for mission-critical applications where downtime and data corruption are not an option.

As the demand for high-performance computing continues to rise, the need for robust and efficient memory solutions becomes more crucial. The introduction of the latest DDR5 R-DIMM revision by G.SKILL caters specifically to industries requiring seamless data processing, such as artificial intelligence (AI), financial analytics, scientific computing, and cloud-based services. The combination of improved signal integrity and reinforced voltage protection makes these modules a strong contender for enterprise workloads where stability is paramount.

G.SKILL has confirmed that these enhanced DDR5 R-DIMM memory kits will be available through its global distribution network, with an expected release in mid-2025. As advancements in computing architectures continue to push hardware capabilities, G.SKILL remains committed to delivering cutting-edge solutions that meet the rigorous demands of modern data centers and professional workstations.

With this latest development, G.SKILL strengthens its position as a leading innovator in the high-performance memory space, bringing industry-grade enhancements to DDR5 R-DIMM technology. Professionals and enterprises looking to upgrade their computing infrastructure can expect a blend of reliability, efficiency, and top-tier performance with these latest memory modules.

Source

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v-color Unveils SCC O CUDIMM RGB Filler Kit with Speeds Up to 8800MT/s https://xiaomitoday.com/v-color-unveils-scc-o-cudimm-rgb-filler-kit-with-speeds-up-to-8800mt-s/ https://xiaomitoday.com/v-color-unveils-scc-o-cudimm-rgb-filler-kit-with-speeds-up-to-8800mt-s/#respond Thu, 13 Feb 2025 09:10:52 +0000 https://xiaomitoday.com/?p=16143 v-color Technology Inc. has expanded its DDR5 memory lineup with the introduction of the SCC O CUDIMM RGB Filler Kit 2+2, featuring two DRAM modules and two filler modules. This latest addition enhances performance and customization options for PC builders and enthusiasts. The new SCC O CUDIMM modules are fully compatible with Intel Core Ultra […]

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v-color Technology Inc. has expanded its DDR5 memory lineup with the introduction of the SCC O CUDIMM RGB Filler Kit 2+2, featuring two DRAM modules and two filler modules. This latest addition enhances performance and customization options for PC builders and enthusiasts. The new SCC O CUDIMM modules are fully compatible with Intel Core Ultra CPUs and 800 series motherboards, supporting speeds up to 8800MT/s. Additionally, the existing SCC UDIMM kit has received an upgrade, now reaching speeds of 8000MT/s with dual profile support for Intel XMP 3.0 and AMD EXPO.

Designed to complement Intel Core Ultra CPUs and Z890 motherboards, the new CKD SCC O CUDIMM modules deliver high-speed performance with stability. The 32GB (2x16GB) configuration achieves speeds between 8000MT/s and 8200MT/s, while the 48GB (2x24GB) configuration reaches between 7000MT/s and 8800MT/s. The SCC technology also extends its impact to UDIMMs, which now operate at speeds ranging from 7200MT/s to 8000MT/s. With dual profiles, these memory kits ensure seamless integration across both Intel XMP 3.0 and AMD EXPO platforms, catering to a broad range of users from gamers to professional content creators.

Premium Build with SK Hynix ICs

The SCC memory modules utilize 100% SK Hynix ICs, ensuring consistent quality, reduced power consumption, and optimized latency for gaming and productivity tasks.

Advanced RGB Customization

Both the SCC O CUDIMM and Filler Kit support major motherboard RGB control software. Additionally, v-color has collaborated with SignalRGB to enhance the synchronization of lighting effects across different components, offering users a more immersive RGB experience.

v-color SCC O CUDIMM RGB Kit

The SCC 2+2 filler combo consists of two RGB DRAM modules and two non-DRAM RGB dummy sticks. These filler modules are designed to populate unused DIMM slots, creating a uniform and visually appealing memory configuration.

Patented Innovations

  • RGB Dummy Filler Kit Technology: Covered under Patent No. (USA) US-10,285,273 B1 and (Taiwan) M562483, enhancing the functionality and design of non-DRAM filler kits.
  • Optimized Cooling Solutions: A custom heatsink design for individual memory chips ensures effective heat dissipation. This cooling innovation is protected under Patent No. 113208127.
  • Exclusive Light Guide Rod: The filler modules feature a specialized coating technology (Patent No. M653290) that enhances the visual appeal, even when RGB effects are turned off.
v-color SCC O CUDIMM RGB PCB

The Xfinity series introduces an all-white PCB and a matching white heatsink, complementing high-end builds that emphasize both performance and style. This design upgrade ensures a cohesive and premium look for users seeking a visually refined system.

The new v-color SCC O CUDIMM RGB Filler Kits will be available for purchase starting February 14th on Amazon, Newegg, and the official v-color website. Additional availability through authorized distribution channels is expected in the near future. 

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V-Color Technology Unveils Industry’s First Overclockable DDR5 OC RDIMM Modules https://xiaomitoday.com/v-color-technology-unveils-industrys-first-overclockable-ddr5-oc-rdimm-modules/ https://xiaomitoday.com/v-color-technology-unveils-industrys-first-overclockable-ddr5-oc-rdimm-modules/#respond Thu, 09 Jan 2025 16:04:06 +0000 https://xiaomitoday.com/?p=15260 V-Color Technology Inc., a global manufacturer specializing in advanced memory solutions, has officially introduced the world’s first overclockable DDR5 RDIMM modules. Designed for enterprise-grade applications, these modules are available in capacities of 128GB and 256GB per module, with configurations scaling up to an unprecedented 2,048GB (2TB) using 8x256GB modules. The v-color DDR5 OC RDIMM are […]

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V-Color Technology Inc., a global manufacturer specializing in advanced memory solutions, has officially introduced the world’s first overclockable DDR5 RDIMM modules. Designed for enterprise-grade applications, these modules are available in capacities of 128GB and 256GB per module, with configurations scaling up to an unprecedented 2,048GB (2TB) using 8x256GB modules. The v-color DDR5 OC RDIMM are fully optimized for GIGABYTE’s AI Top Series TRX50 and W790 motherboards, targeting use cases that demand exceptional memory performance, such as high-performance computing (HPC), large-scale data analysis, and cloud infrastructure.

Revolutionizing Memory for Enterprise Workloads

The new DDR5 OC RDIMM modules address growing demands for high-density, reliable, and high-speed memory solutions in modern data-intensive industries. Their advanced design and compatibility with the latest AMD Ryzen™ Threadripper™ Pro and Intel Xeon platforms make them an excellent fit for AI-driven workloads, real-time analytics, and next-generation computing systems.

These modules boast groundbreaking performance, combining high memory density, overclocking capability, and enterprise-grade stability. Their introduction paves the way for enhanced computing environments that require optimal processing power and reliability.

Key Features and Benefits

  1. Unmatched Capacity for Complex Operations
    The modules, built using advanced Richtek PMIC (Power Management Integrated Circuit) technology, deliver capacities of 128GB and 256GB per module, enabling configurations that scale up to 2TB in an eight-module setup. This level of capacity is particularly suited for applications such as AI model training, real-time big data analysis, and enterprise-class virtualization.
  2. Built-in ECC for Data Integrity
    Error-Correcting Code (ECC) technology is integrated to automatically detect and correct memory errors, ensuring reliability for critical workloads where data accuracy and stability are paramount.
  3. Industry-Leading Overclocking Speeds
    These modules redefine overclocking for registered DIMMs, reaching speeds of up to 6000MT/s with low timings of CL38. Such performance levels cater to memory-intensive applications and deliver smooth, reliable results under demanding conditions.
  4. Compatibility with Advanced Platforms
    Thoroughly tested for compatibility, these modules are tailored for GIGABYTE’s AI Top Series TRX50 and W790 motherboards, supporting AMD and Intel’s latest processors. This ensures seamless integration for users building cutting-edge systems.

Performance Showcase on GIGABYTE AI Top Motherboards

v-color DDR5 OC RDIMM Motherboard

The v-color DDR5 OC RDIMM modules were rigorously tested on GIGABYTE’s AI Top W790 and TRX50 motherboards, showcasing their potential in real-world applications:

  • On W790 with Intel Xeon Processors:
    • 2TB configuration (8x256GB): Overclocked to 5600MT/s
    • 1TB configuration (4x256GB): Overclocked to 5600MT/s
  • On TRX50 with AMD Ryzen™ Threadripper™ Pro:
    • 2TB configuration (8x256GB): Overclocked to 5600MT/s
    • 1TB configuration (4x128GB): Overclocked to 6000MT/s


These test results underscore the exceptional performance of v-color’s DDR5 OC RDIMM modules, delivering both high capacity and speed for enterprise and professional use cases.

Speaking about the launch, Tomson Ho, CEO of v-color Technology Inc., emphasized the company’s dedication to advancing memory technology. “The introduction of the world’s first overclockable RDIMM modules marks a significant milestone in our pursuit of innovation. These modules were designed to push the limits of performance, capacity, and reliability, empowering industries with the tools they need to handle tomorrow’s challenges,” Ho stated.

He also highlighted the successful collaboration with GIGABYTE, which ensured these modules operated seamlessly with the AI Top Series motherboards to deliver exceptional results.

The v-color DDR5 OC RDIMM modules, available in 128GB and 256GB configurations and scalable up to 2TB, will begin shipping globally this January. Customers will be able to purchase them via v-color’s official website, authorized retailers, and selected online platforms.

This release marks a significant step forward in-memory technology, enabling enterprises and professionals to optimize their computing environments for emerging applications and data-driven workloads.

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PNY Introduces High-Speed DDR5 Notebook Memory Kits https://xiaomitoday.com/pny-introduces-high-speed-ddr5-notebook-memory-kits/ https://xiaomitoday.com/pny-introduces-high-speed-ddr5-notebook-memory-kits/#respond Thu, 09 Jan 2025 15:34:01 +0000 https://xiaomitoday.com/?p=15249 PNY has officially announced the release of its latest high-performance DDR5 notebook memory kits, designed to deliver next-level computing power for demanding users. Available in 64 GB (2x32GB) and 32 GB (2x16GB) configurations, the modules run at an impressive speed of 5600 MHz with a CAS latency of 46, setting a new benchmark for performance […]

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PNY has officially announced the release of its latest high-performance DDR5 notebook memory kits, designed to deliver next-level computing power for demanding users. Available in 64 GB (2x32GB) and 32 GB (2x16GB) configurations, the modules run at an impressive speed of 5600 MHz with a CAS latency of 46, setting a new benchmark for performance in portable computing.

The new PNY DDR5 notebook memory is built to support the latest DDR5 standard, offering enhanced speed, efficiency, and capacity compared to its DDR4 predecessor. With the ability to handle significantly larger data loads, DDR5 technology increases module densities up to four times greater than DDR4, making it an essential upgrade for creators, gamers, and professionals. The 5600 MHz frequency ensures high-speed performance, reducing bottlenecks and improving overall system responsiveness for multitasking, gaming, and intensive workloads.

PNY’s DDR5 modules are engineered with on-die Error Correction Code (ECC) to improve data integrity and efficiency, making them particularly suited for professional environments where reliability is critical. The modules operate at a reduced voltage of 1.1V, offering better energy efficiency compared to DDR4, which helps extend battery life in laptops while minimizing heat generation.


An integrated Power Management IC (PMIC) on the module allows for more precise voltage regulation, reducing electrical noise and enabling better power efficiency. This feature also provides greater headroom for voltage adjustments, ensuring consistent performance under demanding conditions.

Detailed Specifications

  • Frequency: 5600 MHz (PC5-44800)
  • Capacities: 64 GB Kit (2x32GB), 32 GB Kit (2x16GB)
  • Voltage: 1.1V
  • CAS Latency: 46
  • Warranty: Limited Lifetime with 24/7 U.S.-based technical support

These features make PNY DDR5 notebook memory a robust solution for users seeking a reliable and high-performing upgrade for their systems.

The PNY Performance DDR5 Notebook Memory kits will be available at major retailers starting mid-January. The pricing is set as follows:

  • 64 GB (2x32GB): $149.99
  • 32 GB (2x16GB): $82.99

These competitive prices make the kits accessible for a wide range of users looking to enhance their laptop’s capabilities with the latest in memory technology.

PNY‘s commitment to delivering premium-quality products is evident in the robust specifications and features of its new DDR5 memory kits. By bridging the gap between performance and efficiency, the company aims to meet the needs of power users and professionals alike, cementing its position as a leader in memory solutions.

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G.SKILL and ASUS ROG Push Overclocking Limits with DDR5 Memory on Crosshair X870E Apex Motherboard https://xiaomitoday.com/g-skill-and-asus-rog-push-overclocking-limits-with-ddr5-memory-on-crosshair-x870e-apex-motherboard/ https://xiaomitoday.com/g-skill-and-asus-rog-push-overclocking-limits-with-ddr5-memory-on-crosshair-x870e-apex-motherboard/#respond Wed, 08 Jan 2025 12:39:59 +0000 https://xiaomitoday.com/?p=15146 G.SKILL has once again demonstrated the power of its DDR5 memory by achieving remarkable overclocking feats in collaboration with ASUS ROG. The focus of this latest achievement revolves around the new ASUS ROG Crosshair X870E Apex motherboard, which has proven to be a highly capable platform for pushing the boundaries of memory performance. Achieving DDR5-10600 […]

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G.SKILL has once again demonstrated the power of its DDR5 memory by achieving remarkable overclocking feats in collaboration with ASUS ROG. The focus of this latest achievement revolves around the new ASUS ROG Crosshair X870E Apex motherboard, which has proven to be a highly capable platform for pushing the boundaries of memory performance.

In a notable demonstration of memory overclocking, G.SKILL, in partnership with the ASUS ROG team, achieved an extraordinary memory speed of DDR5-10600 using a dual-channel 48 GB (2x24GB) memory kit. This overclocking feat was tested under demanding conditions, with the memory and processor subjected to Memtest stress tests. The setup utilized the ASUS ROG Crosshair X870E Apex motherboard paired with an AMD Ryzen 5 8500G desktop processor, both of which were kept cool underwater chiller cooling.

This overclocking attempt pushes the limits of what is achievable with current memory technology, showcasing the potential of DDR5 in high-performance setups. The results from the Memtest stress test confirmed the stability and reliability of the memory configuration, setting a new benchmark for extreme memory speeds.

In addition to the exceptional DDR5-10600 speed, G.SKILL also highlighted the stability and performance of DDR5-6800 CL28-40-38-55 at 1.65V, operating at a 1:1 ratio between UCLK and MCLK. This demonstration used a 48 GB (2x24GB) memory kit on the ASUS ROG Crosshair X870E Apex motherboard, paired with an AMD Ryzen 7 9800X3D desktop processor. The system passed the Memtest stress test, further proving the reliability and performance of G.SKILL DDR5 memory at high clock speeds under extreme overclocking conditions.

ROG Crosshair X870E Apex Benchmark

By using the 1:1 ratio of UCLK:MCLK, the setup maintained excellent memory synchronization, enhancing system performance and stability. This achievement underscores the high potential of G.SKILL DDR5 memory to support both high-speed and stable configurations, making it ideal for enthusiasts and professionals seeking top-tier performance.

The overclocking capabilities of the ASUS ROG Crosshair X870E Apex motherboard, in combination with G.SKILL DDR5 memory, were further showcased when multiple overclocking records were broken using the latest AMD Ryzen 9 9950X desktop processor. Under the guidance of Safedisk, a skilled overclocker, a series of benchmarking records were shattered, further solidifying the performance potential of G.SKILL memory.

These record-breaking feats demonstrate the extraordinary overclocking headroom available when pairing high-end components, such as the AMD Ryzen 9 9950X processor and the ASUS ROG Crosshair X870E Apex motherboard, with G.SKILL’s premium DDR5 memory. The collaboration between these components highlights their synergy in achieving new overclocking milestones, contributing to the growing reputation of the ASUS ROG brand as a leader in performance motherboards.

Through this collaboration, G.SKILL and ASUS ROG have demonstrated the capabilities of their latest hardware in the world of overclocking. With record-breaking memory speeds, including the astonishing DDR5-10600 and DDR5-6800 configurations, G.SKILL DDR5 memory continues to push the envelope in performance and stability. Enthusiasts and overclockers alike will be excited to see what the future holds as both companies continue to refine and push the boundaries of high-performance computing.

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TeamGroup Awarded Two National Invention Patents, Expanding Innovations in Memory and Storage Technologies https://xiaomitoday.com/teamgroup-awarded-two-national-invention-patents-expanding-innovations-in-memory-and-storage-technologies/ https://xiaomitoday.com/teamgroup-awarded-two-national-invention-patents-expanding-innovations-in-memory-and-storage-technologies/#respond Thu, 19 Dec 2024 19:33:39 +0000 https://xiaomitoday.com/?p=14503 TeamGroup Inc., a global leader in memory and storage technology, has secured two significant invention patents, showcasing its advanced research and development capabilities. The company’s gaming-focused brand, T-FORCE, was awarded a U.S. invention patent for Memory Structure, while its creator-centric brand, T-CREATE, earned a Taiwan invention patent for Memory Card Health Detection Method and Memory […]

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TeamGroup Inc., a global leader in memory and storage technology, has secured two significant invention patents, showcasing its advanced research and development capabilities. The company’s gaming-focused brand, T-FORCE, was awarded a U.S. invention patent for Memory Structure, while its creator-centric brand, T-CREATE, earned a Taiwan invention patent for Memory Card Health Detection Method and Memory Card Structure. These breakthroughs represent key advancements in high-performance memory and intelligent storage solutions, strengthening TeamGroup’s position at the forefront of the industry.

To address the demanding needs of gamers, TeamGroup’s T-FORCE LAB developed the Memory Structure technology, now patented in the United States. This technology has been implemented in flagship products such as the XTREEM ARGB DDR5, DELTA RGB DDR5, and DELTA RGB ECO DDR5 memory modules. The innovation focuses on overcoming heat and power constraints typically associated with high-frequency operations. By optimizing voltage distribution across memory units, RGB LED components and control units, the technology minimizes power consumption and heat generation while maintaining peak performance.

The use of low-dropout regulators (LDOs) ensures precise power delivery to the RGB/ARGB LED and control units, enhancing operational stability and extending the lifespan of the memory modules. This design allows T-FORCE memory products to maintain reliable performance at elevated frequencies, providing gamers with the stability and responsiveness required for competitive play.

For creators, TeamGroup T-CREATE brand introduced the EXPERT S.M.A.R.T. MicroSDXC memory card, incorporating patented health monitoring technology. The Taiwan invention patent highlights the Memory Card Health Detection Method and Memory Card Structure, enabling users to assess the health status of their memory cards in real-time.

The system utilizes advanced flash memory wear detection, allowing creators to monitor card performance and lifespan via S.M.A.R.T. monitoring software on a PC. This proactive approach shifts the focus from data recovery to prevention, addressing a critical gap in traditional storage solutions.

The T-CREATE EXPERT S.M.A.R.T. MicroSDXC card also features industrial-grade engineering, incorporating a high-performance chip design for enhanced shock resistance and heat tolerance. These capabilities ensure reliable operation under challenging conditions, empowering creators to focus on their projects without concerns over data integrity or hardware failure.

TeamGroup continues to prioritize innovation, combining cutting-edge technology with user-focused design. These patented advancements reflect the company’s commitment to providing premium solutions for gamers, creators, and professionals worldwide.

The integration of innovative features such as enhanced power efficiency, advanced monitoring systems, and robust design reaffirms TeamGroup’s dedication to delivering stability, performance, and reliability.

For further updates on TeamGroup’s latest developments and product releases, follow their official social channels.

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Colorful Unveils iGame Shadow Series DDR5 Memory: Blending Performance and Artistic Design https://xiaomitoday.com/colorful-unveils-igame-shadow-series-ddr5-memory-blending-performance-and-artistic-design/ https://xiaomitoday.com/colorful-unveils-igame-shadow-series-ddr5-memory-blending-performance-and-artistic-design/#respond Thu, 19 Dec 2024 19:09:16 +0000 https://xiaomitoday.com/?p=14497 Colorful Technology, a prominent name in gaming PC components, gaming laptops, and Hi-Fi audio products, has officially introduced the iGame Shadow Series DDR5 memory. Designed with both performance and aesthetics in mind, the new memory modules feature an artistic heatsink inspired by traditional Chinese ink wash paintings. Additionally, the modules include ARGB lighting that integrates […]

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Colorful Technology, a prominent name in gaming PC components, gaming laptops, and Hi-Fi audio products, has officially introduced the iGame Shadow Series DDR5 memory. Designed with both performance and aesthetics in mind, the new memory modules feature an artistic heatsink inspired by traditional Chinese ink wash paintings. Additionally, the modules include ARGB lighting that integrates seamlessly with the iGame Center software for synchronized illumination across compatible setups.

The iGame Shadow DDR5 Series memory is engineered to deliver exceptional performance while adding a touch of artistry to PC builds. The memory modules are available in a wide range of configurations, catering to both mainstream users and high-end enthusiasts. The series spans from DDR5-6000 CL28 to DDR5-8400 CL42, providing options for various performance requirements.

Built with high-quality SK Hynix M-die, these modules are optimized for overclocking, making them an excellent choice for users looking to push their systems to the limit. The aluminum alloy heatsink is designed to maximize heat dissipation, ensuring stable performance under heavy workloads.

The iGame Shadow Series memory is compatible with both AMD and Intel platforms, offering certified configurations for optimized performance. For AMD Ryzen systems, the memory kits come with AMD EXPO certification, ensuring power efficiency and low latency. The available EXPO-certified configurations include:

  • DDR5-6000 CL28
  • DDR5-6400 CL30
  • DDR5-6400 CL28

For Intel platforms, particularly the Intel 890 chipset, the series offers kits with speeds of up to DDR5-8000. COLORFUL also plans to release DDR5-8400 kits for enthusiasts seeking extreme performance in the near future.

In addition to the standard iGame Shadow Series, COLORFUL has announced plans to release CUDIMM memory with CKD configurations, designed for extreme overclocking. These modules will feature speeds ranging from DDR5-8800 to DDR5-9600, with potential overclocking capabilities exceeding 10,000 MT/s, catering to the most demanding users and competitive overclockers.

The iGame Shadow DDR5 memory kits are currently available on JD.com, with additional configurations set to be released in the future. Pricing details for the available kits are as follows:

  • DDR5-6800 2x24GB (48GB) CL34 Kit: ¥1049
  • DDR5-8000 2x24GB (48GB) CL40 Kit: ¥1349

The memory modules will soon be available through partner resellers, expanding their accessibility to global markets.

With the iGame Shadow Series DDR5 memory, COLORFUL combines high-performance hardware with a unique aesthetic design. Whether for gaming, content creation, or professional workloads, these memory kits provide users with a reliable and visually appealing solution tailored to meet the needs of modern PC enthusiasts and professionals alike.

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