The Glacier One D30 X2 is part of the company’s expanding NEXLINQ product line and introduces the latest D30 series fans. These fans are designed to interconnect, forming a single, rigid frame. This approach reduces cable clutter, as both lighting and fan speed can be controlled through a single connection. It also improves the overall appearance of the build by minimizing visible wiring.

Thermal performance is handled by a large copper base and a dense fin array, which together help dissipate heat efficiently, even under heavy workloads. The cooler is compatible with Intel’s LGA 1700, 1200, and 115x sockets, as well as AMD’s AM4 and AM5 platforms, making it suitable for most modern processors.

Phanteks has also focused on physical compatibility. The Glacier One D30 X2 is built with clearance in mind, allowing it to fit into a wide range of cases without interfering with tall memory modules or large VRM heatsinks. The pump cover is made from brushed aluminum and features a compact design inspired by the company’s Evolv X2 series. An integrated fan within the pump housing helps direct airflow over nearby motherboard components, including VRMs and M.2 drives, contributing to better system stability.

The cooler’s appearance is clean and modern, and it is available in both black and white to match different system themes. The D-RGB lighting on the fans and pump cover adds subtle customization without being overbearing.

Phanteks is positioning the Glacier One D30 X2 as a reliable cooling solution that combines practical design with solid performance. Its updated fan system, broad compatibility, and streamlined layout are intended to simplify the building process and improve everyday use.

The 360mm version of the Phanteks Glacier One D30 X2 is now available in black and white color options, each priced at $179.99 / €179.90 / £159.90. The larger 420mm version will be available in May, priced at $189.99 / €189.90 / £169.90. More information can be found on the official Phanteks website.

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The FA‑EX9 measures 192 × 190 × 55 mm and fits within a 2-liter chassis. It includes a 16-core processor based on AMD’s Zen 5 architecture and a built-in graphics solution with 40 compute units from the RDNA 3.5 generation. A separate processing unit is also included for handling specialized tasks, rated for up to 50 trillion operations per second. FEVM has tuned the processor to run at up to 120 watts of continuous power, placing it in the same performance category as some high-end laptop setups that combine top-tier CPUs with dedicated graphics cards.

For memory, the FA‑EX9 includes 128 GB of LPDDR5X running across a 256-bit interface. Of that total, up to 96 GB can be used by the built-in graphics, providing headroom for handling complex workloads. Storage options consist of two M.2 PCIe 4.0 slots, supporting up to 2 TB on a single drive and up to 16 TB total capacity when fully populated.

In terms of external connectivity, the system includes one HDMI 2.1 output, one DisplayPort 1.4, and two USB4 Type-C ports, allowing for support of up to four displays at 8K resolution. There is also an OCuLink interface, which provides the option to connect a desktop graphics card externally.

The FA‑EX9 appears to be designed with flexibility in mind, capable of supporting a range of use cases, including content creation, development workloads, and entertainment. Its design and feature set suggest that FEVM is positioning it as a compact workstation that can fit into small spaces without sacrificing capability.

This new system enters the market at a time when other manufacturers are also introducing high-performance mini PCs. For example, NVIDIA’s recently announced DGX Spark features its Grace Blackwell superchip and is built for performance in a small chassis. The Spark combines a 20-core processor with a new graphics engine and is optimized for complex computing tasks. It includes 128 GB of memory, up to 4 TB of storage, and network connectivity that supports 200 Gbps.

While both systems are compact, the FA‑EX9 provides more expandability and balanced general-purpose computing, whereas the DGX Spark is more focused on performance tuning and specific high-demand applications.

FEVM has not yet shared a release date or price for the FA‑EX9, but the hardware specifications suggest it is aimed at professionals who need strong computing power in a compact desktop. More information is expected to follow soon.

Sources: FEVN

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As applications continue to demand more memory, especially in tasks involving large datasets, complex video processing, or machine learning models, the need for both speed and capacity in system memory becomes more critical. The new G.SKILL kit aims to meet that demand by combining ultra-high density with competitive overclocked performance.

Tested with AMD EXPO memory profiles, the kit has been validated on platforms including the ASUS ROG CROSSHAIR X870E HERO paired with the AMD Ryzen 7 9800X3D, as well as the MSI MPG X870E CARBON WIFI with the Ryzen 9 9900X. These platforms have successfully demonstrated stable operation at DDR5-6000 CL32 using the full 256 GB capacity.

G.SKILL also demonstrated the overclocking potential of this memory configuration by pushing it to DDR5-7000 with timings of CL38-50-50. This was achieved on the MSI MEG X870E GODLIKE motherboard alongside the Ryzen 7 9800X3D processor. Running at this level is notable, as maintaining high frequencies while using high-capacity modules across all four slots can often present stability challenges.

In addition to performance at higher frequencies, G.SKILL showcased the 256 GB kit operating at DDR5-6400 with CL32 timings across a mix of hardware configurations. These include the ASUS ROG CROSSHAIR X870E HERO with the Ryzen 9 9900X3D, and the MSI MAG B850M MORTAR WIFI motherboard paired with the Ryzen 7 9800X3D. Achieving low-latency performance at 6400 MT/s across four 64 GB modules reflects both strong binning of memory ICs and careful tuning of platform compatibility.

This memory kit adds to G.SKILL’s growing lineup of DDR5 products and represents a step forward in capacity and performance for users building systems for intensive multitasking, data-heavy workflows, or future-ready computing tasks. As high-capacity DDR5 becomes more available and supported across platforms, these kits provide another option for users looking to push the limits of their desktop or workstation builds.

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The Hong Kong Electronics Fair is one of Asia’s largest electronics trade shows and regularly attracts key players across the global tech industry. LincPlus will use this platform to demonstrate new offerings aimed at users looking for compact, powerful, and easy-to-manage solutions for data storage and creative workflows.

LincStation NAS Series to Take Center Stage

LincPlus will debut the LincStation NAS series at the exhibition, which includes two models: the LincStation S1 and the LincStation N2.

The LincStation S1 is built for small businesses and creative professionals who need scalable, secure storage. It runs on an Intel Alder Lake-N N97 quad-core processor and includes 8 GB of DDR5 RAM, which can be upgraded. It supports up to four 3.5-inch SATA hard drives and two M.2 NVMe SSDs, offering a combined storage capacity of up to 112 TB. Dual 2.5GbE Ethernet ports support fast file transfers, and the system runs UnRAID OS, a flexible platform for storage management and virtualization. The hybrid SSD/HDD setup gives users flexibility between speed and capacity.

Meanwhile, the LincStation N2 caters to users seeking a compact, all-SSD storage solution. It features an Intel Alder Lake-N N100 processor and 16 GB of LPDDR5 memory. The unit houses four M.2 NVMe SSD slots and two 2.5-inch SATA bays, with network connectivity through a 10GbE RJ45 port. The N2 is designed for tasks that demand high throughput, such as media streaming, project collaboration, and remote access. It also uses UnRAID OS, giving users tools for file sharing, backup, and containerized applications.

Both NAS units focus on ease of use and centralized data access without subscription-based cloud storage fees, making them practical options for users who prefer on-premises solutions.

LincStudio S1: A Portable Creative Workstation

In addition to its NAS lineup, LincPlus will introduce the LincStudio S1, a 13-inch all-in-one tablet designed for content creators. It comes equipped with an Intel 11th Gen Core i7-1165G7 processor and Intel Iris Xe Graphics. With 16 GB of LPDDR4X RAM and a 512 GB SSD, the device is built to handle demanding creative tasks.

The display is a 13-inch In-cell IPS panel with a 2160×1440 resolution and 100% sRGB color coverage. It includes a Wacom EMR stylus with 4096 pressure levels and tilt recognition, making it suitable for drawing, photo editing, and graphic design. Running on Windows 11, the LincStudio S1 supports standard desktop applications and creative software suites.

Weighing just 1.1 kg, the tablet includes a detachable keyboard and an integrated stand, making it easy to carry and use on the go. It also features two Thunderbolt 4 USB-C ports, one USB-A 3.0 port, a headphone jack, and front and rear cameras (8MP and 13MP). A 39.33Wh battery supports extended use away from a power source.

Focus on Practical Design and User Needs

LincPlus continues to position itself as a brand focused on practical innovation. Its in-house R&D and supply chain allow for tight integration between design and manufacturing. At this year’s show, the company is emphasizing usability, performance, and form factor across its product range.

Visitors to the Hong Kong Electronics Fair can explore the new LincPlus products in person, view live demos, and discuss use cases with the company’s technical representatives. With the introduction of the LincStation series and the LincStudio S1 tablet, LincPlus aims to address key needs in storage and mobility for small businesses and creative professionals.

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At the center of the LANCOOL 207 Digital’s new features is a 6-inch touchscreen embedded into the lower front panel of the case. The display has a resolution of 720×1600, a 60 Hz refresh rate, and brightness rated at 500 nits. It is connected via USB and controlled through LIAN LI’s L-Connect 3 software. This screen allows users to monitor real-time data such as CPU and GPU temperatures, fan speeds, and system load. It also supports background customization using personal videos or images. In addition to acting as a monitoring tool, the screen functions as a secondary display and can show system information even when the main PC is powered off, thanks to its Offline Mode.

Internally, the LANCOOL 207 Digital retains the unique design elements introduced in the original LANCOOL 207. This includes a front-mounted power supply unit (PSU) and a recessed motherboard tray. These design choices help optimize internal space and allow for better airflow while keeping the overall dimensions compact. This layout is especially helpful for users installing larger graphics cards, as it clears up space around the PCIe area and simplifies cable routing.

To ensure effective cooling, the case comes equipped with two 140 mm PWM fans at the front and two 120 mm PWM fans mounted on the bottom. This setup is designed to provide immediate airflow toward the graphics card and maintain system-wide ventilation. The top of the case supports radiators up to 360 mm, offering compatibility for custom or all-in-one liquid cooling solutions. Dust filters are also integrated at key intake and exhaust points to help keep the interior clean over time.

The LANCOOL 207 Digital continues LIAN LI’s approach of providing functional PC cases with builder-friendly features. It offers toolless panels, removable drive cages, and well-thought-out cable management paths. Despite the inclusion of a secondary display and additional fan support, the case remains affordable, targeting users who want a feature-rich chassis without crossing into premium pricing territory.

The LANCOOL 207 Digital will be available starting April 18, 2025, in black. Further details, including specifications and accessory support, can be found on LIAN LI’s official product page.

Specifications

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The TeamGroup X2 MAX Portable SSD supports the USB 3.2 Gen 2×1 interface, offering read and write speeds of up to 1,000 MB/s. This makes it suitable for tasks involving large file transfers, such as 4K video editing or moving high-resolution image libraries. The drive comes with dual connectors—USB Type-A and Type-C—allowing it to be used with a wide range of devices, including Windows PCs, Macs, Android phones, and gaming consoles like PlayStation and Xbox.

With a weight of just 12 grams and a maximum capacity of 2 TB, the X2 MAX is designed for portability without compromising on storage space. It eliminates the need for extra adapters or cables, as the built-in connectors provide direct access for most modern devices. Whether used for storing AAA game titles or backing up important work files, the X2 MAX provides a flexible option for users needing fast and reliable storage on the go.

Also announced is the TeamGroup S5 USB Flash Drive, which features a USB 3.2 Gen 1 interface and supports read speeds of up to 140 MB/s. Built using Chip On Board (COB) technology, the S5 is more resistant to physical damage, moisture, and dust. This enhances its durability and helps maintain data integrity even under frequent use.

The S5 is available in capacities from 32 GB to 512 GB and weighs only 2 grams. Its lightweight body includes a large built-in keyhole, making it easy to attach to keychains or bags. The drive’s design supports both everyday use and secure data storage for travel or work environments.

TeamGroup offers a five-year warranty on the X2 MAX Portable SSD and a lifetime warranty for the S5 Flash Drive, underlining its commitment to quality and long-term support. Both products are expected to be available through TeamGroup’s global distribution network in the coming weeks.

With the launch of these two devices, TeamGroup continues to expand its portfolio with storage solutions that combine performance, portability, and broad compatibility for users across different platforms.

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The REDMI G Pro 27U features a 27-inch 4K display panel with support for both 4K at 160Hz and Full HD at 320Hz refresh rates. This dual high refresh capability allows users to switch between ultra-high resolution for detailed visuals and extremely fast refresh rates for smooth gaming performance, depending on their needs.

At the core of the monitor is a 1152-zone Mini LED backlight system, allowing for precise local dimming. Combined with a peak brightness of 1600 nits, the G Pro 27U supports HDR1000 and Dolby Vision standards, offering a detailed and vibrant viewing experience. The monitor also integrates Xiaomi’s custom-developed Local Dimming algorithm and intelligent scene recognition technology, which dynamically adjusts the backlight based on the content displayed. Users can choose from four levels of light control to match different usage scenarios.

Powered by the flagship MT9655 processor, the monitor delivers a 1ms gray-to-gray (GTG) response time. It is also FreeSync Premium Pro certified and supports dynamic variable refresh rate (VRR), which helps minimize screen tearing and stuttering during gameplay.

The monitor is equipped with Surge HyperOS 2, Xiaomi’s own operating system, offering smart TV-like features. With built-in dual 5W stereo speakers and far-field voice control, users can activate Xiaomi’s Xiao Ai assistant for hands-free operation. A single button can switch the monitor into TV mode, making it versatile for both work and entertainment.

In terms of color performance, the G Pro 27U delivers 99% coverage of the DCI-P3 and Adobe RGB color gamuts, along with full coverage of sRGB. It also features 10-bit color depth and supports 1.07 billion colors, with factory-calibrated color accuracy rated at ΔE<1, which is suitable for professional-grade photo and video editing.

Design-wise, the monitor uses a three-sided narrow bezel display with ambient rear backlighting. It also includes a pull-out headphone holder, a joystick for menu navigation, and a sturdy hexagonal base. For connectivity, it provides HDMI 2.1 and DisplayPort 1.4 interfaces to support high-bandwidth input from PCs and consoles.

With this release, Xiaomi continues to expand its presence in the premium monitor segment, offering a feature-rich display aimed at users who demand both performance and versatility. The REDMI Monitor G Pro 27U is currently open for pre-orders, with availability expected in the coming weeks.

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The B650M Snow Dream adopts a standard square M-ATX layout and provides two full-length PCIe 4.0 slots. While both are physically full-sized, only the top slot runs at full x16 bandwidth, and the second operates at x4. Additionally, the board includes three PCIe 4.0 x4 M.2 slots for high-speed NVMe SSDs, providing ample storage expansion for mainstream users.

In terms of memory, the motherboard includes only two DIMM slots and one slot spacing channel (1SPC), supporting DDR5 memory at speeds of 7200 MT/s and beyond when overclocked. While the dual-slot configuration limits maximum memory capacity compared to four-slot alternatives, it should still meet the needs of most gaming or productivity builds focused on speed and stability.

Power delivery is handled by a 19-phase VRM design, although the specific breakdown of power phases has not been detailed. CPU power input is supplied through an 8+4-pin EPS connector setup. JGINYUE has also included a stylized “Snow Dream” emblem on the left VRM heatsink, consistent with the board’s white-themed design.

For networking, the board uses a Realtek RTL8125BG controller, supporting 2.5GbE via a standard RJ45 port. A slot for an M.2 PCIe wireless networking card is also included, but not pre-populated. On the audio side, the board is equipped with a Realtek ALC897 codec, which provides basic onboard sound capabilities suitable for everyday use, though it may fall short for users seeking higher fidelity output.

Rear I/O connectivity includes two USB 3.x Type-A ports, one USB 3.x Type-C port, four USB 2.0 Type-A ports, HDMI and DisplayPort video outputs, one 2.5GbE LAN port, two Wi-Fi antenna connectors, an S/PDIF-out, and two 3.5mm audio jacks. Onboard headers feature a USB 3.x Type-C 5Gbps connector, a 1-to-2 USB 2.0 header, a 1-to-2 USB 3.x header, and four 5V ARGB (4-1 pin) headers for RGB customization.

The JGINYUE B650M Snow Dream appears to be positioned as a visually distinctive and compact platform for AMD’s latest generation processors, with a focus on PCIe 4.0 expansion, high-speed storage, and modest networking and audio features. Pricing and global availability details have yet to be confirmed by the manufacturer.

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The RTX 5060 Ti brings with it a substantial update in specifications compared to its predecessors. It features 4,608 CUDA cores and will be available in two configurations—one with 16 GB of GDDR7 memory and another with 8 GB. Both versions use high-speed GDDR7 memory running at up to 28 Gbps. The card also includes 5th-generation Tensor Cores, which deliver up to 759 TOPS of AI compute performance, enabling better performance in supported applications and games through NVIDIA DLSS 4 and other AI-based enhancements.

Manli is launching the RTX 5060 Ti in three custom series: Stellar, Polar Fox, and Nebula. Each series is tailored for different audiences, focusing on form factor, aesthetics, cooling, and performance.

Stellar Series

The Stellar Series is designed with a focus on both appearance and acoustic performance. The shroud features a gradient-colored finish, aiming for a more refined visual design. Underneath, Manli uses its third-generation patented fans and wave-shaped heatsink layout, which are engineered to reduce noise by improving airflow efficiency. The design targets users who want a quiet yet capable system with a touch of style.

Polar Fox Series

Targeted at users with a preference for anime and ACG (Animation, Comic, Game) culture, the Polar Fox Series blends aesthetics with functionality. The model is available in both triple-fan and twin-fan versions to accommodate different PC case sizes. The twin-fan version is particularly suited for smaller builds without sacrificing the benefits of the Blackwell GPU. Each Polar Fox graphics card also comes with a branded phone holder as part of the bundle.

Nebula Series

The Nebula Series focuses on practicality and compact design. Built with a twin-fan layout, it is aimed at users with small form factor systems who still want the performance advantages of the RTX 5060 Ti. The card includes a reinforced backplate with an updated ventilation system that helps improve thermal performance. While the Nebula Series adopts a more traditional design, it’s intended to offer solid performance and durability.

Manli’s latest lineup highlights its effort to cater to a wide range of PC users. Whether building a high-performance gaming rig, a creator’s workstation, or a compact mini-PC, the new RTX 5060 Ti offerings are designed to deliver the capabilities of the Blackwell architecture in various form factors and styles.

The Manli GeForce RTX 5060 Ti series is expected to become available through global distribution channels soon. Pricing and regional availability will be announced by local partners.

Source: Manli

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The teaser image prominently features a covered device, which appears to be a monitor, accompanied by a game controller and a remote control. While the exact nature of the product has not been revealed, the imagery suggests that it may be a display targeted at gamers, possibly bundled with gaming peripherals or designed for console-like interactions.

The official promotional text mentions that users of the device can “enjoy the audio-visual feast while performing cool operations and defeat their opponents in minutes,” a statement that further reinforces the product’s gaming focus. Although no specific features have been detailed, the term “dual-mode” might imply support for both console and PC gaming, or potentially a combination of gaming and media consumption functionalities.

This announcement follows closely after Xiaomi’s earlier release of the Redmi Monitor A27U Energy-Saving Version on April 12. That model came in both a standard version and a Type-C version, with a focus on efficiency and productivity. Given this timeline, Xiaomi appears to be maintaining a steady release cycle for its display products under the Redmi sub-brand.

In addition, the Redmi Turbo 4 Pro smartphone is also scheduled to launch this month. While Xiaomi has not confirmed whether the phone and the new gaming product will share a launch event, the timing raises the possibility that multiple devices could be introduced together. The Turbo 4 Pro is expected to be a performance-oriented device, which could complement the gaming theme of tomorrow’s reveal.

Redmi has been gradually expanding its product ecosystem to cater to a wider audience of gamers and performance users. With the launch of its new e-sports-related product, Xiaomi seems to be positioning Redmi as more than just a smartphone brand, potentially aiming to compete in the broader gaming hardware space.

More details about the specifications, pricing, and availability of the new product will likely be shared during the official launch event. Fans and prospective buyers can tune in tomorrow to get a full look at what Xiaomi has planned.

Source

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